Dicing Wafers with DISCO Saws and Dicing Blades

Dicing bumped wafers or dicing sapphire substrates, Disco dicing saws and dicing blades deliver excellent results. With facilities on the East and West coasts, difficult dicing requirements for all materials can be processed with extremely short lead-times.

Information on dicing various materials:

• dicing site map - Wafer and substrate dicing information
• dicing - Dicing hybrid, semiconductor and MEMS circuits
• custom dicing - Custom dicing, sawing and singulating
• bonded-wafers - Dicing bonded MEMS wafers and substrates
• ceramic-substrates - Dicing ceramic substrates, wafers and plates
• dicing-sawing - Dicing and cutting sapphire wafers and substrates

Other services include:

• Wafer and substrate edge grinding, rounding, chamfering, blending and polishing.
• V-grooves, laser slag removal, pyramids, slots and steps.

Return to Home Page: Sapphire wafers and sapphire substrates

C-Plane Sapphire Dicing Sapphire SOS Sapphire

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